NEC Electronics Components on ICGOODFIND SiteMap
最新文章
- Silicon Wafer Prices Surge 10% Across All Sizes – First Major Hike in 3 Years
- AMEC H1 Profit Triples to $396M – $490M Lingang Fab Expansion Underway
- Cypress Semiconductor Chip Selection Guide｜FRAM, USB Controller & PSoC Programmable SoC Overview
- ADI Hits Record $4.02B Quarterly Revenue – Analog Chip Boom Fueled by AI Data Centers
- Cixi Technology Secures $136M Series – Edge AI Chip Startup Races for Agentic Compute
- TSMC Arizona Profit Soars 661% – US Fab Overtakes Nanjing as Top Overseas Earner
- 2026 IC Supplier Risk Matrix: Lead Time Delay & Price Hike Risk Ranking of Major Chip Vendors
- TL323X Debuts at IOTE 2026 Shenzhen – Telink’s Multi‑Protocol Wireless SoC for IoT
- 700V Half-Bridge GaN IC Cuts Motor Drive Size for 220V Variable-Frequency Home Appliances
- SK Hynix Restarts Dalian Fab 2 – 50% NAND Capacity Boost by 2027
- TSMC in Talks to Buy Two AUO Panel Fabs for $210M – Panel-Level Packaging Push
- Apple Tests CXMT DRAM for iPhone & MacBook – New Supplier in Play
- China Power Semi Player Kuaweitie Buys Jingyi for $230M – Big Goodwill, Big Bet
- Nokia Buys a Fab to Secure InP Optical Chips – Supply Play for AI Data Centers
- Five Domestic 60V Non-Synchronous Buck Converters – Automotive & Industrial Power Options Compared
- HP, ASUS, Acer Adopt CXMT DRAM in Small-Batch PC Production Amid Global Memory Shortage
- Renesas to Shut Down 6-Inch Takasaki Fab in 2–3 Years – Shifts Production to 8-Inch Lines
- Montage Tech Starts CXL 3.2 MXC Chip Trial Production – 64GT/s Memory Controller for AI Servers
- Samsung Q2 Profit Soars 1,814% to Record $64B – But Phone Business Posts First Loss Since 2009
- SK Hynix Q2 Net Margin Hits 118% – Revenue Surges 257% to $56.5B on AI Memory Boom
- Lattice Semiconductor Chip Series Overview | CPLD / FPGA / Power Management IC Application Guide
- Cadence Q2 Revenue Hits $1.58B – Backlog Surges to $8.1B as AI Agents Reshape Chip Design
- NVIDIA’s First U.S.-Made GB300 AI Chip Debuts – Fab21 4nm, but CoWoS Still Missing
- Broadcom Popular Communication Chips Cheat Sheet for Hardware Engineers | PHY, Switch, Automotive, Gateway
- Intel Q2 Revenue Soars 25% to $16.1B – Highest Growth in 15 Years
- ABB Acquires Advantics – Snaps Up SiC Power Conversion Tech for Data Centers & Microgrids
- SK Hynix Denies Intel Ohio Fab Acquisition – Both Firms Silence Rumor
- Google Locks Gemini Into Silicon with Frozen v2 – Targeting 10x Tokens per Watt
- Kimi K3 Designs a 146k-Cell Chip in 48 Hours – AI-Driven Silicon Validation
- AOS Alpha & Omega Semiconductor Full Product Line Overview: Popular MOSFET & Power IC Selection Guide
- Intel 18A Yield Hits 85% – Apple, AMD, Nvidia Sign On; Foundry Revenue Set for 2030
- Tower Semiconductor Plans ¥600B Japan Investment for Silicon Photonics Fab
- Tower Semiconductor Plans ¥600B Japan Investment for Silicon Photonics Fab
- EastCore DF1000 Debuts – Software-Defined 3D Compute-in-Memory AI Chip on 14nm
- MediaTek June Revenue Ticks Up 2.8% – H1 2026 Edges Down 0.8%
- Samsung Develops GAIA – 4nm AI PC Accelerator Chip Set for 2027 Mass Production
- 2026 Hot IoT Module Combo: U-BLOX GNSS Positioning Modules + SIMCOM 2G Cellular Modules
- SMMBT2222ALT1G NPN Bipolar Junction Transistor: Datasheet, Application Circuit, and SOT-23 Package Analysis
- onsemi MC74HC1G14DFT1G Single Schmitt-Trigger Inverter Datasheet and Application Overview
- onsemi NBRS2H100T3G-VF01: 100V Schottky Rectifier for High-Efficiency Power Conversion
- onsemi NTMFS5C410NT1G: 30V Single N-Channel MOSFET PowerTrench® MOSFET for High-Efficiency Power Management
- onsemi PCA9306FMUTAG: Bidirectional I2C-Bus Voltage-Level Translator
- onsemi NCP303LSN28T1G: High-Performance Voltage Supervisor for Enhanced System Reliability
- Single Channel Non-Inverting Buffer: onsemi NLVVHC1G125DFT1G
- onsemi FUSB251UCX: Advanced USB Type-C Port Controller for Next-Generation Connectivity
- YAGEO Resistor & Capacitor Product Line Introduction | Full Coverage of Common Models
- DDR2 Prices Soar 60% as AI Hungers Consume Legacy DRAM – Full-Category Memory Rally Intensifies
- SemiAnalysis: ChangXin Memory to Overtake Micron as #3 DRAM Supplier by Year‑End 2026
- Micron Q3 FY2026 Revenue Hits $41.46B, AI Memory Demand Drives 1,398% Net Income Surge
- KYOCERA AVX Tantalum Capacitor Guide | Prefix Meaning, Key Parameters & Popular Models
- EU Approves €76M Grant for World’s First Quantum Chip Tester Plant in Munich
- Groq Raises $650M, Shifts from Chips to AI Inference Cloud Provider
- ICGOODFIND: Electronic Component & IC Purchasing Guide | Essential Skills & Practical Tips for Beginners
- SiC Unicorn Basic Semiconductor Files HK IPO: $43M Revenue, $47M Loss, Backed by Bosch and Wingtech
- ICgoodFIND 2026 Duanwu Festival Holiday Notice
- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
- Samsung Pushes DSEP Platform, Targets Fully Automated Wafer Fab by 2030
- onsemi Appoints He Maojun as China VP and GM for System Products
- Top‑10 Foundries Post Record Q1 Revenue – TSMC at 72% Share, Nexchip Jumps to #8
- Hanmi Semiconductor Invests ₩50B in SpaceX Ahead of Its $1.77T Nasdaq Debut
- SK Hynix to Mass‑Produce 375‑Layer 3D NAND by Year‑End, Switches to Molybdenum for Word Lines
- Nikon Develops New Digital Lithography Tool for Advanced Packaging: 30% Higher Throughput<
- Cadence and Nvidia Debut Level‑5 Autonomous AI Chip Design Engineer: ChipStack AI Super Agent
- Diodes Expands AH371xQ Automotive Hall Latch Family for BLDC Motor Sensing
- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
- TSMC CEO Wei: Nanjing Fab Has No Risk, $56B CapEx for 2026, ‘Wish Elon Well’ on His Fab
- Q1 2026 DRAM Revenue Surges 81% to $97B, Contract Prices Nearly Double
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- Lightmatter Joins Nvidia NVLink Fusion Ecosystem to Power AI Optical Interconnects
- NXP LPC1114FHN33/302,5: A Comprehensive Technical Overview of the ARM Cortex-M0 Microcontroller
- Dual D-Type Flip-Flop IC: A Comprehensive Guide to the NXP HEF4013BT,652
- NXP GPS1502LX: A Comprehensive Overview of its Features and Applications
- NXP BZX384-B24,115: A Comprehensive Technical Overview of the 24V Zener Diode
- NXP HEF4069: A Comprehensive Guide to the Hex Inverting Buffer/Converter IC
- NXP BZX585-C12,115: A Comprehensive Technical Overview of the 12V Zener Diode
- NXP LPC1311FHN33: A Comprehensive Technical Overview of the ARM Cortex-M3 Microcontroller
- Anthropic Confidentially Files for IPO at $965B Valuation, Outpacing OpenAI
- NXP BZX384-B56: A Comprehensive Technical Overview of the 56V Zener Diode
- Samsung Overtakes Micron as No.1 in Global Automotive Memory Market
- China Big Fund Trims Stakes in NSIG, Debang, SMIC – Market Reaction Muted
- Tencent’s Canghai V1 Tops MSU Hardware Encoding Contest; V2 Set for H2 2026 Mass Production
- Guangdong Guangbao Microelectronics Faces Bankruptcy Over Unpaid Debts
- NXP BTA416Y-800C: A Comprehensive Technical Overview of the 800V, 40A Solid-State Relay
- NXP TDA8024TT: A Comprehensive Technical Overview of its Architecture and Smart Card Interface Applications
- Unlocking High-Performance Embedded Design with the NXP LPC54606J512BD100 Microcontroller
- NXP PMN48XP: A Comprehensive Overview of its Architecture and Applications
- The NXP NX7002BKS is a dual N-channel enhancement mode MOSFET integrated into a single SC-70 (SOT-323) package, designed for high-density, low-power circuit design. This device is engineered to provid
- NXP BUK7K15-80EX: A High-Performance Automotive MOSFET for Demanding Applications
- NXP PMBT3904M: A Comprehensive Technical Overview of the General-Purpose NPN Switching Transistor
- NXP MCIMX7D3DVK10SC: A Comprehensive Overview of the i.MX 7Dual Applications Processor
- Sensirion Launches STC42A Automotive Hydrogen Sensor for Battery Thermal Runaway Detection
- Asia’s March Chip Exports Surge 81% as AI Demand Drives Unprecedented Price-Volume Gap
- SiTime Elite 2 Super-TCXO Cuts AI Cluster Sync to Sub‑1ns, Boosts GPU Utilization
- TSMC’s Japan Fab JASM Turns Profitable for First Time in Q1 2026
- NXP 74HCT2G125DP: A Comprehensive Technical Overview of the Dual Bus Buffer Gate with 3-State Outputs
- The NXP BZV55-C30 is a 500 mW, 30 V Zener diode in a SOD-80 (MiniMELF) surface-mount package, designed for voltage regulation and protection in compact electronic circuits. This diode maintains a stab
- NXP S9S12GN32F0MLF: A Comprehensive Technical Overview of the 16-bit HCS12 Microcontroller Family
- NXP NX20P5090UK: A Comprehensive Overview of its Features and Applications
- NXP PMPB10XNE: A Comprehensive Technical Overview of NXP's Advanced Power Management IC
- SMIC Q1 Sales Hit $2.505B, Gross Margin Rises to 20.1% on Pricing Power