MARVELL IN115050-LE02-23GC-S02P: Technical Specifications and Application Overview

The MARVELL IN115050-LE02-23GC-S02P represents a sophisticated and highly integrated component designed for next-generation data infrastructure. This device is engineered to address the escalating demands for higher bandwidth, lower power consumption, and increased connectivity density in modern data centers, enterprise networks, and 5G telecommunications equipment.

Technical Specifications

At its core, the IN115050-LE02-23GC-S02P is a high-performance, multi-gigabit transceiver or physical layer (PHY) device, leveraging Marvell's proven signal integrity and power efficiency technologies. Key specifications include:

Data Rate Support: This component is designed to support data rates up to 25 gigabits per second (Gbps) per channel, making it suitable for 25G and 100G (4x25G) Ethernet applications, aligning with the prevalent standards in top-of-rack (ToR) switches and server interconnects.

Advanced Process Node: Fabricated on an advanced low-power CMOS process, the device achieves a significant reduction in power-per-bit, a critical metric for large-scale deployments where operational expenditure (OPEX) and thermal management are paramount.

Integrated DSP: It features a highly sophisticated digital signal processor (DSP) that enables advanced signal conditioning, including electronic dispersion compensation (EDC) and adaptive equalization. This ensures robust performance over various media, including direct attach copper (DAC) cables and printed circuit board (PCB) traces, even in the presence of signal degradation and crosstalk.

Interface and Protocol Compliance: The device complies with key industry standards such as IEEE 802.3by for 25GBASE-KR and 25GBASE-CR and is often employed in CAUI-4 and CAUI-2 interfaces for 100G applications. It typically interfaces with the media access controller (MAC) via a SFI-style SerDes interface.

Packaging: Housed in a compact, thermally efficient package, it is designed for high-density PCB layouts common in modern switch and router line cards.

Application Overview

The primary application for the MARVELL IN115050-LE02-23GC-S02P is within the data path of high-speed networking equipment. Its design is optimized for several critical roles:

Data Center Switches: It serves as a fundamental building block in Top-of-Rack (ToR) and Leaf switches, providing the physical layer connectivity for server-to-switch and inter-switch links. Its support for 25G and 100G Ethernet is essential for handling east-west traffic within modern data centers.

Network Interface Cards (NICs): High-performance servers utilize this technology in dual-port and quad-port 25G NICs to eliminate network bottlenecks and ensure rapid access to data and storage networks.

5G Wireless Infrastructure: In the radio access network (RAN), this component is used in fronthaul and midhaul equipment to transport massive amounts of data from 5G radio units to the core network, meeting the low-latency and high-bandwidth requirements of 5G.

Active Optical Cables (AOCs) and Transceivers: The device is often found inside the control circuitry of advanced pluggable optical modules (e.g., SFP28 and QSFP28), where it manages the high-speed electrical-to-optical signal conversion.

ICGOOODFIND

This component is a quintessential ICGOOODFIND for engineers and procurement specialists designing cutting-edge network hardware. It exemplifies the critical innovation required to build the high-speed, efficient, and reliable infrastructure that powers cloud computing, artificial intelligence, and global communications. Its blend of high performance, integration, and power efficiency makes it a standout solution in a competitive market.

Keywords: 25G Ethernet, Physical Layer (PHY), Data Center Networking, Signal Integrity, Low Power Design.